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1.Between semiconductor and heat sink
2.Between CPU and radiator
3.Between the resistor and the base
4.Thermoelectric cooling device
5.Temperature regulator and a mounting surface

Specifications:
1KG/jar

Storage conditions:
Stored in a cool and dry place, seal placed

Performance and Advantage:
Thermal conductivity : 1.5W/m-k
Thermal impedance : 0.06℃-in/W

Extremely low thermal resistance , better transmission heat

Complete wetting contact surface, improving the heat dissipation effect
Safety and environmental protection, through the RoHS certification

Features:
High thermal conductivity, electrical insulation and use stability, good high and low temperature resistant performance.
Water resistance, not curing, metal material on contact without corrosion (copper, aluminum, steel);
Extremely low volatile loss, not dry, not melt, good adaptability and large temperature range (- 50 ∽ + 250 ℃);
Non-toxic, tasteless, no corrosion, and chemical and physical properties of stability.