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Thermal silicone pads are elastic, solid-state thermal interface materials made from a silicone base mixed with thermal fillers such as aluminum oxide and boron nitride. They are classified as thermal interface materials and are placed between heat-generating chips and heat sinks; they do not generate cooling but are solely responsible for transferring heat. They are commonly used between heat-generating components—such as computer graphics cards, laptops, LED lights, routers, switching power supplies, charging stations, industrial control motherboards, automotive electronics, and battery modules—and heat sinks.
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Thermal ceramic sheets are advanced inorganic non-metallic materials that combine high thermal conductivity with excellent electrical insulation properties. They are widely used in high-power electronic equipment, new energy vehicles, photovoltaic inverters, and high-frequency communications. These materials primarily address the challenge of heat dissipation in electronic components operating under heavy loads while ensuring the safe electrical isolation of circuits. Currently, the mainstream thermal ceramic sheets on the market are primarily divided into two categories: aluminum oxide (Al₂O₃) and aluminum nitride (AlN).
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Thermal conductive silicone cloth, also known as thermal silicone cloth or tear-resistant silicone cloth, is an insulating material made of an organosilicon polymer elastomer reinforced with a glass fiber substrate. This material achieves efficient heat conduction by reducing the contact thermal resistance between electronic components and heat sinks. It features high dielectric strength, resistance to chemical corrosion, and high-voltage breakdown resistance. With a thermal conductivity of up to 5 W/m·K and a breakdown voltage of over 6 kV, it can replace traditional mica and silicone grease as an insulating medium for electronic devices.
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Thermal graphite film is a carbon-based heat dissipation material characterized by high planar thermal conductivity and ultra-thin, flexible properties. Through highly oriented grain structure, it rapidly diffuses heat from point sources across a larger surface area, making it widely used in thermal management for consumer electronics and high-end electronic devices. Its primary function is to rapidly distribute localized hotspots generated by chips (SoCs, RF components, batteries) laterally across the device’s metal frame or back cover, thereby preventing localized overheating. It is often used in combination with vapor chamber (VC) heat spreaders and heat pipes (the VC is responsible for “transporting heat,” while the graphite film is responsible for “distributing heat”).
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Single-component RTV adhesive is a silicone elastomer material that requires no mixing and cures automatically at room temperature by reacting with moisture in the air. It offers key properties such as ready-to-use convenience, electrical insulation, resistance to high and low temperatures (-60°C to 250°C), and weather-resistant sealing.
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Thermal conductive potting compounds are specialized materials developed to address heat dissipation and protection issues in electronic devices. They consist of a base resin, thermal conductive fillers, a curing agent, and other additives. The base resin forms the main component and serves to bond and shape the material; common types include silicone resin, epoxy resin, and polyurethane resin.
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“Insulating particles” is not a single, standardized term; it generally refers to insulating fasteners used in electronic assemblies (insulating beads/transistor spacers), but in specific scientific contexts, it may also refer to packing materials for three-dimensional electrode reactors or nano-modified insulating additives; the meaning must be distinguished based on the context.
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Thermal conductive double-sided tape is an industrial adhesive material made from an acrylic polymer composite containing thermal conductive ceramic powder and an organic silicone adhesive. It is primarily used to secure heat sinks to chips in industries such as electronics, electrical appliances, and LED lighting. This material uses glass fiber cloth or a substrate-free backing as its carrier, combining flexibility, compressibility, and conformability. It also features thermal conductivity of 0.8–1.6 W/mK and insulation properties with a volume resistivity greater than 10¹³ Ω·cm, with an operating temperature range spanning -20°C to 180°C (up to 288°C for short periods).
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Electromagnetic shielding materials are essential for preventing electromagnetic interference or leakage and are widely used in electronic devices, communication systems, aerospace, medical equipment, and military applications. Their core function is to protect equipment from external interference or prevent internal signals from leaking out by reflecting, absorbing, or attenuating electromagnetic waves.
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Shenzhen Jiarifengtai Electronic Materials Co., Ltd., established in 2010, is a subsidiary of Jiarifengtai Group (Hong Kong) Co., Ltd. It is a high-tech enterprise specializing in the research, development, production, and sales of electronic thermal conductive and insulating materials. The company primarily offers four major product series: 1. Thermal Silicone Series: (High) thermal silicone sheets, (High) thermal silicone cloth (sheets), thermal potting compounds, RTV single-component silicone, thermal grease, thermal paste, silicone tubing, TO-220 and TO-3P insulating caps, and thermal dou...
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